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• Introduction  
• Sn-Pb Properties and Models  
• Sn-Ag Properties and Creep Data  
• Sn-Ag-Cu Properties and Creep Data  
• General Conclusions/ Recommendations  
• Acknowledgements  
• References  
     
  For more information contact:  
  metallurgy@nist.gov  
 
Sn-Ag-Cu Properties and Creep Data
 
  Overview  
  "SAC" Creep Data  
  • Source and Plot of Data  
  • Specimens  
  • Microstructures  
  • Test Procedures  
  "SAC" Creep Data Analysis and Modeling  
  • Fit of Kariya's and Schubert's Models  
  • Review of SAC Data  
  • Regression Analysis  
  Fit of Additional Data to First Order Creep Model  
  • Kim et al.'s Data and Effect of Cooling Rate  
  • NCMS' Compression Creep Data  
  • Flip-Chip Solder Joint Shear Data  
  Addemdum: Microstructure and Cooling Rate Effects  
  Other "SAC" Properties  
  • Young's Modulus vs. Temperature  
  • Poisson's Ratio  
  • Coefficients of Thermal Expansion (CTE)  
  • Other Physical Properties  
  Conclusions on SAC Properties  
 
Metallurgy Division of MSEL | metallurgy@nist.gov
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Last modified: Thursday, 21 February, 2008 by Metallurgy Webmeister